Soldering of end chip components in series

ABSTRACT

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

BACKGROUND

This disclosure relates generally to printed circuit board designrework, and in particular, to soldering of end chip components in seriesfor print circuit board design rework.

A circuit card assembly is typically a printed circuit board utilizingsurface-mount technology (SMT) and through-hole technology to attachvarious electronic components to the printed circuit board. Situationscan arise where a design of the printed circuit board of the circuitcard assembly requires alteration. A circuit design may require analternation in resistance, current, voltage and/or capacitance. To avoidscrapping the circuit card assembly and prior to the printed circuitboard design rework being complete, different assembly lines arecontracted to do printed circuit board design rework by stacking SMTcomponents, disconnecting various traces, and adding jumper wires.Current printed circuit board design rework utilizes the addition ofjumper wires, adhesive, and the direct attachment of a single side ofthe chip component to the printed circuit board surface. This type ofdesign rework typically does not stay within an area of an originaldiscrete location.

SUMMARY

A first aspect of an embodiment of the present invention discloses amethod for printed circuit board design rework, the method comprisingselecting a first chip component and a second chip component forplacement on an original land location previously occupied by anoriginal chip component. The method further comprises placing the firstchip component and the second chip component on a chip component supportstructure. The method further comprises soldering a first end of thefirst chip component to a first end of the second chip component. Themethod further comprises, responsive to transferring the first chipcomponent and the second chip component to the original land location,soldering a second end of the first chip component to a first land ofthe original land location. The method further comprises soldering asecond end of the second chip component to a second land of the originalland location, wherein the first chip component, the second chipcomponent, and the original land location are in a triangularorientation.

A second aspect of an embodiment of the present invention disclosesanother method for printed circuit board design rework, the methodcomprising selecting a first chip component and a second chip componentfor placement on an original land location previously occupied by anoriginal chip component. The method further comprises, responsive toholding the first chip component at a first designated angle at a firstland of the original land location, soldering the first chip componentto the first land. The method further comprises, responsive to holdingthe second chip component at a second designated angle at a second landof the original land location, soldering the second chip component tothe second land. The method further comprises soldering the first chipcomponent to the second chip component at a peak formed by the firstchip component and the second chip component at the original landlocation.

A third aspect of an embodiment of the present invention discloses anapparatus for printed circuit board design rework, the apparatuscomprising a first chip component, a second chip component, and anoriginal land location, wherein the original land location incudes afirst land and a second land for mounting an original chip component.The apparatus further comprises a first end of the first chip componentelectrically and mechanically coupled to a first end of the second chipcomponent. The apparatus further comprises a second end of the firstchip component electrically and mechanically coupled to the first land.The apparatus further comprises a second end of the second chipcomponent electrically and mechanically coupled to the second land,wherein the first chip component and the second chip component areposition in a standing triangular position on the first lead and thesecond lead.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The following detailed description, given by way of example and notintended to limit the disclosure solely thereto, will best beappreciated in conjunction with the accompanying drawings, in which:

FIG. 1 depicts a top view of two chip components in series utilizing anoriginal land location on a printed circuit board, in accordance with anembodiment of the present invention.

FIG. 2 depicts a side view for placement of a single chip componentutilizing an original land location on a printed circuit board, inaccordance with an embodiment of the present invention.

FIG. 3 depicts a side view of a chip component support structure forcreation of two chip components in series for an original land locationon a printed circuit board, in accordance with an embodiment of thepresent invention.

FIG. 4 depicts a side view of a chip component support structure withtwo chip components prior to soldering, in accordance with an embodimentof the present invention.

FIG. 5 depicts a side view of a chip component support structure withtwo chip components with a soldered peak, in accordance with anembodiment of the present invention.

FIG. 6 depicts a side view of two chip components with a soldered peakprior to placement on an original land location on a printed circuitboard, in accordance with an embodiment of the present invention.

FIG. 7 depicts a side view of two chip components in series soldered toan original land location on a printed circuit board, in accordance withan embodiment of the present invention.

FIG. 8 depicts a process for a printed circuit board design rework withtwo chip components in series utilizing an original land location on aprinted circuit board, in accordance with an embodiment of the presentinvention.

DETAILED DESCRIPTION

Embodiments of the present invention provides printed circuit boarddesign rework with two chip components in series utilizing an originalland location on a printed circuit board. For circuit card assemblies,there are instances when a printed circuit board design needs to bechanged (i.e., rework). A circuit design may need to have an alterationin resistance, current, voltage, and/or capacitance. To avoid scrappingthe circuit card assembly and prior to a new printed circuit boarddesign being implemented, different assembly lines are contracted toperform printed circuit board design rework by stacking surface mounttechnology (SMT) components, disconnecting various traces, and addingjumper wires. A common printed circuit board design rework includesplacing rectangular or square end chip components in series. Typicalattempts to perform the printed circuit board design rework includesutilizing jumper wires, adhesive, and direct attachment to one side ofthe chip component to the printed circuit board surface, where therework exceeds the area (i.e., land) of an original discrete location.Embodiments of the present invention allow for the placements of twochip components in series, while maintaining the original discretelocation on the printed circuit board.

For the printed circuit board design rework where the chip componentsare resistors, utilizing two chip components in series allows for adoubling and a dramatic increase in resistance of a circuit. For printedcircuit board design rework where the chip components are capacitors,utilizing two chip components in series allows for a reduction incapacitance while increasing an amount of voltage the circuit canhandle. Embodiments of the present invention includes a first chipcomponent electrically coupled in series to a second chip component in atriangular orientation on a top surface of a printed circuit board,where the first chip component is electrically coupled to a first landlocation on the top surface of the printed circuit board and the secondchip component is electrically coupled to a second land location on thetop surface of the printed circuit board. The two chip components wouldideally be of similar dimensions when performing the printed circuitboard design rework to ensure a symmetrical orientation between thefirst land and the second land, but a mismatch of dimensions between thetwo-chip component can also provide the series structure required.

To position the two chip components in series between the two lands onthe printed circuit board, the two chip components are electrically andmechanically coupled in series with soldered prior to transferring thetwo chip components to the printed circuit board. To electrically andmechanically couple the two chip components in series prior totransferring the two chip components to the printed circuit board, thetwo chip components are held utilizing one or more of: an e-glassfixture, a vacuum holder, mechanical grippers, removable glue, andmanually by hand. Furthermore, the electrically and mechanicallycoupling of the two chip components in series can be automated in a massproduction setting. For manual and/or low frequency situation, a similarsolder can be utilized to electrically and mechanically couple the twochip components in series to the two lands on the printed circuit board,as was utilized to join the two chip components. If a mass productionprocess is required to merge components prior to placement on theprinted circuit board, a higher melt solder is utilized to attach thetwo components to one another and a lower melt solder is utilized toattach the two components to the printed circuit board. To providestrain relief to solder joints, an adhesive can be applied to the twocomponents subsequent to electrically and mechanically coupling to theprinted circuit board.

Embodiments of the present invention allow for the development ofspecific resistance, capacitance, and/or voltages in the printed circuitboard design rework. Specifically for capacitance, allowing foradditional capacitors to be in series lowers an overall capacitance butresults in a larger amount of voltage to exist in the circuit increasingoperational safety. Furthermore, the additional capacitors in seriesresults in tighter tolerances. Embodiments of the present invention alsofor the jumping over of bare traces on the printed circuit board, withminimal concerns of causing shorts and an increased ease of inspection.Though the printed circuit board design rework with two chip componentsin series utilizing an original land location on a printed circuit boardrelates to a direct application on the printed circuit board, the twochip components in series can be extended to soldering the two chipcomponents on top (i.e., stacking) of another chip component and/ordevice. The two chip components can utilize a first lead and a secondlead of the other chip component and/or device.

Detailed embodiments of the present invention are disclosed herein withreference to the accompanying drawings; however, it is to be understoodthat the disclosed embodiments are merely illustrative of potentialembodiments of the invention and may take various forms. In addition,each of the examples given in connection with the various embodiments isalso intended to be illustrative, and not restrictive. This descriptionis intended to be interpreted merely as a representative basis forteaching one skilled in the art to variously employ the various aspectsof the present disclosure. In the description, details of well-knownfeatures and techniques may be omitted to avoid unnecessarily obscuringthe presented embodiments.

For purposes of the description hereinafter, terms such as “upper”,“lower”, “right”, “left”, “vertical”, “horizontal”, “top”, “bottom”, andderivatives thereof shall relate to the disclosed structures andmethods, as oriented in the drawing figures. Terms such as “above”,“overlying”, “atop”, “on top”, “positioned on” or “positioned atop” meanthat a first element, such as a first structure, is present on a secondelement, such as a second structure, wherein intervening elements, suchas an interface structure may be present between the first element andthe second element. The term “direct contact” means that a firstelement, such as a first structure, and a second element, such as asecond structure, are connected without any intermediary conducting,insulating or semiconductor layers at the interface of the two elements.The term substantially, or substantially similar, refer to instances inwhich the difference in length, height, or orientation convey nopractical difference between the definite recitation (e.g. the phrasesans the substantially similar term), and the substantially similarvariations. In one embodiment, substantial (and its derivatives) denotea difference by a generally accepted engineering or manufacturingtolerance for similar devices, up to, for example, 10% deviation invalue or 10° deviation in angle.

In the interest of not obscuring the presentation of embodiments of thepresent invention, in the following detailed description, someprocessing steps or operations that are known in the art may have beencombined together for presentation and for illustration purposes and insome instances may have not been described in detail. In otherinstances, some processing steps or operations that are known in the artmay not be described at all. It should be understood that the followingdescription is rather focused on the distinctive features or elements ofvarious embodiments of the present invention.

FIG. 1 depicts a top view of two chip components in series utilizing anoriginal land location on a printed circuit board, in accordance with anembodiment of the present invention. In this embodiment, printed circuitboard design rework 100 includes first chip component 102 in series withsecond chip component 104 utilizing an original land on printed circuitboard 106. An original land on printed circuit board 106 includes firstland 108 and second land 110, where a single chip component waspositioned between first land 108 and second land 110 prior to a designrework. To perform the design rework, first chip component 102 andsecond chip component 104 were placed in series at the original land onprinted circuit board 106 in a standing triangular orientation. A firstend of first chip component 102 is electrically and mechanically coupledto a first end of second chip component 104 via solder joint 112. Solderjoint 112 represents a first fusible metal alloy utilized to create apermanent bond between metal workpieces, where in this embodiment themetal workpieces are the first end of first chip component 102 and thefirst end of second chip component 104.

A second end of first chip component 102 is electrically andmechanically coupled to first land 108 via first solder land joint 114.A second end of second chip component 104 is electrically andmechanically coupled to second land 110 via second solder land joint116. Similar to solder joint 112, first solder land joint 114 and secondsolder land joint 116 represent a second fusible metal alloy utilized tocreate a permanent bond between metal workpieces. In a mass productionsetting, the second fusible metal alloy of first solder land joint 114and second solder land joint 116 would have a lower melting point thanthe first fusible metal alloy of solder joint 112. However, in theillustrated embodiment, the second fusible metal alloy of first solderland joint 114 and second solder land joint 116 has an equal meltingpoint compared to the first fusible metal alloy of solder joint 112(i.e., same solder type).

FIG. 2 depicts a side view for placement of a single chip componentutilizing an original land location on a printed circuit board, inaccordance with an embodiment of the present invention. In thisembodiment, printed circuit board 106 includes first land 108 and secondland 110 with original chip component 202 that previously occupied anoriginal land, prior to the design rework as described above in FIG. 1 .First end 204 of original chip component 202 corresponds to first land108 and second end 206 of original chip component 202 corresponds tosecond land 110, where end distance 208 represents a distance betweenfirst end 204 and second end 206 of original chip component 202. Overalldistance 210 represents an overall length for original chip component202, where both end distance 208 and overall distance 210 are utilizedfor a selection of a support structure described in detail with regardsto FIG. 3 . In one embodiment, it is determined that original chipcomponent 202 does not provide a required resistance of at 2X ohms,where original chip component 202 provides only X ohms of resistance.Based on a distance between first land 108 and second land 110 onprinted circuit board 106, replacing original chip component 202 with Xohm resistance with another chip component with 2X ohm resistance is notpossible due to the larger dimensions of the other chip component with2X ohm resistance exceeding first land 108 and second land 110. However,utilizing the two chip components (i.e., two original chip components202) in series in a standing triangular orientation allows for the 2Xohm resistance required for the circuit, while remaining in the boundsof first land 108 and second land 110 on printed circuit board 106.

In another embodiment, it is determined that original chip component 202provides an excess of capacitance and lower voltage than what isrequired for the circuit, where original chip component 202 provides 2Xmicro-Farads of capacitance. Based on a distance between first land 108and second land 110 on printed circuit board 106, replacing originalchip component 202 with 2X micro-Farads of capacitance with another chipcomponent with X micro-Farads of capacitance is not possible due to thedimensions of the other chip component with X micro-Farads. However,utilizing the two chip components (i.e., two original chip components202) in series in a standing triangular orientation allows for the Xmicro-Farads of capacitance required for the circuit, while remaining inthe bounds of first land 108 and second land 110 on printed circuitboard 106. For example, if original chip component 202 has a capacitanceof 10.2 micro-Farads, utilizing two original components 202 in astanding triangular orientation achieves a new total capacitance of 5.1micro-Farads and an increased voltage through the circuit.

FIG. 3 depicts a side view of a chip component support structure forcreation of two chip components in series for an original land locationon a printed circuit board, in accordance with an embodiment of thepresent invention. In this embodiment, chip component support structure300 corresponds to first land 108 and second land 110 on printed circuitboard 106 from FIGS. 1 and 2 . Chip component support structure 300includes base 302 and chip component holder 304, where chip componentholder 304 is an isosceles triangle for supporting two chip componentsof equal and/or similar length values. Length 306 is equal to length 308of chip component holder 304 to form the isosceles triangle, where angle310 is equal to angle 312. A base of chip component holder 304 is equalto base distance 314 to ensure the two chip components positioned onchip component support structure 300 align with first land 108 andsecond land 110 separated by end distance 208 on printed circuit board106 of FIG. 2 . In another embodiment, chip component holder 304 is ascalene triangle with no equal sides, where length 306, length 308, andend distance 208 are all different length values. The scalene triangleis utilized when the two chip components being solder into series are ofdifferent lengths.

FIG. 4 depicts a side view of a chip component support structure withtwo chip components prior to soldering, in accordance with an embodimentof the present invention. In this embodiment, first chip component 102and second chip component 104 are placed on chip component holder 304,where a first end of first chip component 102 is to be solder to a firstend of second chip component 104 at a peak of chip component holder 304.A second end of first chip component 102 rests on base 302 at point 402and a second end of second chip component 104 rests on base 302 at point404, where point 402 and point 404 are separated by end distance 208. Aspreviously discussed in FIG. 2 , end distance 208 represents thedistance between first land 108 and second land 110 to which originalchip component 202 was electrically and mechanically coupled to. Basedistance 314 is of a length such when first chip component 102 andsecond chip component 104 are places on chip component holder 304, adistance between the second end of first chip component 102 and thesecond of second chip component 104 is equal to end distance 208.Various chip component support structures 300 can correspond to variousend distances 208 separating first land 108 and second land 110 andvarious lengths of first chip component 102 and second chip component104. In some embodiments, chip component holder 304 is removable andinterchangeable from base 302, where various chip component holders 304of varying dimensions are attachable and removeable from base 302 ofchip component support structure 300.

To ensure first chip component 102 and second chip component 104 aretemporarily secured on chip component holder 304 prior to solder beingapplied to the peak to electrically and mechanically couple the firstend of first chip component 102 and to the first end of second chipcomponent 104, insertable wedges can be utilized as further support. Afirst wedge can be inserted at area 406 between the second end of firstchip component 102 and a top surface of base 302 of chip componentsupport structure 300. A second wedge can be inserted at area 408between the second end of second chip component 104 and the top surfaceof base 302 of chip component support structure 300. In otherembodiments, one or more of: an e-glass fixture, a vacuum holder,mechanical grippers, removable glue, and manually by hand, can beutilized to temporarily support first chip component 102 and second chipcomponent 104 in the standup triangular orientation prior to solderbeing applied to the peak to electrically and mechanically couple thefirst end of first chip component 102 and to the first end second chipcomponent 104.

FIG. 5 depicts a side view of a chip component support structure withtwo chip components with a soldered peak, in accordance with anembodiment of the present invention. As first chip component 102 andsecond chip component 104 temporarily rest on base 302 and chipcomponent holder 304 of chip component support structure 300, solderjoint 112 is created by applying solder to the peak to electrically andmechanically couple the first end of first chip component 102 and to thefirst end second chip component 104. An amount of solder applied to thepeak is such that solder does not seep past the first end of first chipcomponent 102 and the first end of second chip component 104, onto chipcomponent holder 304. Solder joint 112 is such that first chip component102 is structurally connected to second chip component 104 and removablefrom base 302 and chip component holder 304 of chip component supportstructure 300.

FIG. 6 depicts a side view of two chip components with a soldered peakprior to placement on an original land location on a printed circuitboard, in accordance with an embodiment of the present invention. Asfirst chip component 102 and second chip component 104 are transferredto first land 108 and second land 110 on printed circuit board 106, asecond end of first chip component 102 is positioned above first land108 and a second end of second chip component 104 is positioned abovesecond land 110. End distance 208 between the second end of first chipcomponent 102 and the second end of second chip component 104 ismaintained due to solder joint 112 providing mechanical support tomaintain an angular orientation between first chip component 102 andsecond chip component 104. Where point 402 of first chip component 102previously contacted base 302 of chip component support structure 300,point 402 is to contact first land 108 on printed circuit board 106.Where point 404 of second chip component 104 previously contacted base302 of chip component support structure 300, point 404 is to contactsecond land 110 on printed circuit board 106.

FIG. 7 depicts a side view of two chip components in series soldered toan original land location on a printed circuit board, in accordance withan embodiment of the present invention. In this embodiment, printedcircuit board design rework 100 includes first chip component 102 inseries with second chip component 104 utilizing an original land onprinted circuit board 106. As previously discussed, an original land onprinted circuit board 106 includes first land 108 and second land 110,where a single chip component (i.e., original chip component 202) waspositioned between first land 108 and second land 110 prior to a designrework. To perform the design rework, first chip component 102 andsecond chip component 104 were placed in series at the original land onprinted circuit board 106 in a standing triangular orientation. A firstend of first chip component 102 is electrically and mechanically coupledto a first end of second chip component 104 via solder joint 112. Asecond end of first chip component 102 is electrically and mechanicallycoupled to first land 108 via first solder land joint 114. A second endof second chip component 104 is electrically and mechanically coupled tosecond land 110 via second solder land joint 116.

FIG. 8 depicts a process for a printed circuit board design rework withtwo chip components in series utilizing an original land location on aprinted circuit board, in accordance with an embodiment of the presentinvention. Chip component rework process 800 represents a printedcircuit board design rework process with two chip components in seriesutilizing an original land location on a printed circuit board. Chipcomponent rework process 800 includes selecting two chip components forplacement on an original land on a printed circuit board (802). Theoriginal land on the printed circuit board included an original chipcomponent for which a circuit design rework is required. In one example,the original chip component is a resistor that does not provide arequired resistance of at 2X ohms, where the original chip componentprovides only X ohms of resistance. Based on a distance between thefirst land and the second land on the printed circuit board, replacingthe original chip component with X ohm resistance with another chipcomponent with 2X ohm resistance is not possible due to the largerdimensions of the other chip component with 2X ohm resistance exceedingthe dimensions of the original land. However, utilizing the two chipcomponents in series in a standing triangular orientation allows for the2X ohm resistance required for the circuit, while remaining in thebounds of the original land location on the printed circuit board. Inanother example, the original chip component is a capacitor thatprovides an excess of capacitance and lower voltage than what isrequired for the circuit, where the original chip component provides 2Xmicro-Farads of capacitance. Based on a distance between the first landand second land on the printed circuit board, replacing the originalchip component with 2X micro-Farads of capacitance with another chipcomponent with X micro-Farads of capacitance is not possible due to thedimensions of the other chip component with X micro-Farads. However,utilizing the two chip components in series in a standing triangularorientation allows for the X micro-Farads of capacitance required forthe circuit, while remaining in the bounds of the original land locationon printed circuit board 106.

Chip component rework process 800 includes providing a chip componentsupport structure based on the dimensions of the two chip components anda distance between a first land and second land of the original land onthe print circuit board (804). Dimensions of a base and a chip componentholder of the chip component support structure are based on a distancebetween the first land and the second land of the original landlocation, since the two chip components are to utilize a first land anda second land of the original land previously utilized by the originalchip component. Furthermore, dimensions of a base and a chip componentholder of the chip component support structure are based a first set anda second set of dimensions corresponding to the two chip componentsrequired for the circuit design rework. Ideally, the two chip componentswould be of the same or similar dimensions to ensure a stable triangularorientation between the two chip components and the original land on theprinted circuit board.

Chip component rework process 800 includes placing the two chipcomponents on a base and chip component holder of the chip componentsupport structure (806) and soldering a first end of a first chipcomponent to a first end of a second chip component at a peak of the twochip components (808). A first chip component is electrically andmechanically coupled to the second chip component via a solder joint atthe peak of the two chip components. The solder joint provides enoughstructural integrate to the two chip components in series to allow forthe transfer from the chip component support structure to the originalland on the printed circuit board. Chip component rework process 800includes transferring the two chip components soldered at the peak tothe printed circuit board, where a second end of the first chipcomponent is placed on the first land and a second end of the secondchip component is placed on the second land (810). Chip component reworkprocess 800 includes soldering the second end of the first chipcomponent to the first land on the printed circuit board (812) andsoldering the second end of the second chip component to the second landon the printed circuit board (814).

In another embodiment, a chip component support structure for the twochip components can be avoid by manual supporting the two chipcomponents during the soldering process. For example, an alternativeprocess includes selecting two chip components for placement on anoriginal land on a printed circuit board and applying solder to a firstland from an original land location on the printed circuit board, whileholding a first chip component at a designated angle for attachment tothe first land. The alternative process further includes applying solderto a second land from the original land on the printed circuit board,while holding a second chip component at another designated angle forattachment to the second land. The alternative process further includesapplying solder to a peak formed by the first chip component and thesecond chip component, where a solder joint is formed at the peak of thetwo chip components. The two chip components form a series between thefirst land and the second land on the original land location on theprinted circuit board.

It is to be noted, that placing two chip components that are capacitorsin series between the first land and the second land on the originalland location on the printed circuit board allows for tighter tolerancecapacitors. For example, a first capacitor has a capacitance of 5.4micro-Farads with a tolerance of +/−1% (i.e., 0.054 micro-Farads) and asecond capacitor has a capacitance of 5.4 micro-Farads with a toleranceof +/−1% (i.e., 0.054 micro-Farads). Utilizing the 3-sigma process, thefirst capacitor and the second capacitor each includes a standarddeviation of 0.018 but with the first capacitor placed in series withthe second capacitor, the total capacitance of 2.7 includes a standarddeviation of 0.0063. The standard deviation of 0.0063 is reduced by 2.8times when placing the first capacitor and the second capacitor inseries on the original land on the printed circuit board. Table A belowhighlights the tighter tolerance capacitances between the two capacitorsin series:

TABLE A Tolerances between two capacitors in series on a single landCapacitor Value 3-Sigma Process First Capacitor 5.4 +/− 1% = 5.4 withStandard 5.4 +/− 0.054 Deviation of 0.018 Second Capacitor 5.4 +/− 1% =5.4 with Standard 5.4 +/− 0.054 Deviation of 0.018 Capacitors in Series2.7 2.7 with Standard Deviation of 0.0063

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting to the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiment, the practical application or technicalimprovement over technologies found in the marketplace, or to enableother of ordinary skill in the art to understand the embodimentsdisclosed herein. It is therefore intended that the present inventionnot be limited to the exact forms and details described and illustratedbut fall within the scope of the appended claims.

What is claimed is:
 1. A method comprising: selecting a first chipcomponent and a second chip component for placement on an original landlocation previously occupied by an original chip component; placing thefirst chip component and the second chip component on a chip componentsupport structure; soldering a first end of the first chip component toa first end of the second chip component; responsive to transferring thefirst chip component and the second chip component to the original landlocation, soldering a second end of the first chip component to a firstland of the original land location; and soldering a second end of thesecond chip component to a second land of the original land location,wherein the first chip component, the second chip component, and theoriginal land location, are in a triangular orientation.
 2. The methodof claim 1, further comprising: providing the chip component supportstructure, wherein the chip component support structure includes a baseand a chip component holder for placement of the first chip componentand the second chip component.
 3. The method of claim 2, wherein thechip component support structure is based on a first set of dimensionsfor the first chip component and a second set of dimensions for thesecond chip component.
 4. The method of claim 2, wherein the chipcomponent support structure is further based on a distance between thefirst land and the second land of the original land location.
 5. Themethod of claim 1, further comprising: transferring the first chipcomponent solder to the second chip component, wherein the second end ofthe first chip component is placed on the first land and the second endof the second chip component is placed on the second land.
 6. The methodof claim 1, wherein a first solder between the first end of the firstchip component and the first end of the second chip component has agreater melting point than a second solder between the second end of thefirst chip component and the first land.
 7. The method of claim 6,wherein the first solder between the first end of the first chipcomponent and the first end of the second chip component has a greatermelting point than a third solder between the second end of the secondchip component and the second land.
 8. The method of claim 7, whereinthe second solder and the third solder have the same melting point. 9.The method of claim 1, wherein the first chip component and the secondchip components are resistors.
 10. The method of claim 1, wherein thefirst chip component and the second chip components are capacitors. 11.A method comprising: selecting a first chip component and a second chipcomponent for placement on an original land location previously occupiedby an original chip component; responsive to holding the first chipcomponent at a first designated angle at a first land of the originalland location, soldering the first chip component to the first land;responsive to holding the second chip component at a second designatedangle at a second land of the original land location, soldering thesecond chip component to the second land; and soldering the first chipcomponent to the second chip component at a peak formed by the firstchip component and the second chip component at the original landlocation.
 12. The method of claim 11, wherein soldering the first chipcomponent to the first land further comprises: soldering a first end ofthe first chip component to the first land.
 13. The method of claim 12,wherein soldering the second chip component to the second land furthercomprises: soldering a first end of the second chip component to thesecond land.
 14. The method of claim 13, wherein soldering the firstchip component to the second chip component further comprises: solderinga second end of the first chip component to a second end of the secondchip component.
 15. The method of claim 14, wherein a first solderbetween the second end of the first chip component and the second end ofthe second chip component has a greater melting point than a secondsolder between the first end of the first chip component and the firstland.
 16. The method of claim 15, wherein the first solder between thesecond end of the first chip component and the second end of the secondchip component has a greater melting point than a third solder betweenthe first end of the second chip component and the second land.
 17. Themethod of claim 16, wherein the second solder and the third solder havethe same melting point.
 18. An apparatus comprising: a first chipcomponent, a second chip component, and an original land location,wherein the original land location incudes a first land and a secondland for mounting an original chip component; a first end of the firstchip component electrically and mechanically coupled to a first end ofthe second chip component; a second end of the first chip componentelectrically and mechanically coupled to the first land; and a secondend of the second chip component electrically and mechanically coupledto the second land, wherein the first chip component and the second chipcomponent are position in a standing triangular position on the firstlead and the second lead.
 19. The apparatus of claim 18, wherein thefirst lead and the second lead are positioned on a printed circuitboard.
 20. The apparatus of claim 18, wherein the first lead and thesecond lead are position on a third chip component.